可编程晶振空白片选型列表

可编程单端有源晶振空白片FP


FP空白片型号封装尺寸
(mmxmm)
信号模式频率范围
(MHz)
精度
(ppm)
温度范围
(℃)
工作电压
(V)
支持系列
SiT8008BI-71-XXX-000.FP00002.0 x 1.6LVCMOS1 - 110±20
±25
±50
-20 ~ +70
-40 ~ +85
1.8 - 3.3SiT1602
SiT8008
SiT8008BI-11-XXX-000.FP00002.5 x 2.0
SiT8008BI-21-XXX-000.FP00003.2 x 2.5
SiT8008BI-31-XXX-000.FP00005.0 x 3.2
SiT8008BI-81-XXX-000.FP00007.0 x 5.0
SiT8009BI-71-XXX-000.FP00002.0 x 1.6LVCMOS115 - 137±20
±25
±50
-20 ~ +70
-40 ~ +85
1.8
2.5 - 3.3
SiT8009
SiT8009BI-11-XXX-000.FP00002.5 x 2.0
SiT8009BI-21-XXX-000.FP00003.2 x 2.5
SiT8009BI-31-XXX-000.FP00005.0 x 3.2
SiT8009BI-81-XXX-000.FP00007.0 x 5.0
SiT2001BI-S1-XXX-000.FP00002.9 x 2.8
(SOT23-5)
LVCMOS1 - 110±20
±25
  ±50
-20 ~ +70
-40 ~ +85
1.8
2.5 - 3.3
SiT2001
SiT8208AI-21-XXX-000.FP00003.2 x 2.5LVCMOS1 - 80±20
±25
±50
-20 ~ +70
-40 ~ +85
1.8
2.5 - 3.3
SiT8208
SiT8208AI-31-XXX-000.FP00005.0 x 3.2
SiT8208AI-81-XXX-000.FP00007.0 x 5.0
SiT8209AI-21-XXX-000.FP00003.2 x 2.5LVCMOS80 - 220±20
±25
±50
-20 ~ +70
-40 ~ +85
1.8
2.5 - 3.3
SiT8209
SiT8209AI-31-XXX-000.FP00005.0 x 3.2
SiT8209AI-81-XXX-000.FP00007.0 x 5.0



可编程差分晶振空白片FP


FP空白片型号封装尺寸
(mmxmm)
信号模式频率范围
(MHz)
精度
(ppm)
温度范围
(℃)
工作电压
(V)
支持系列
SiT9121AI-1B1-XXX000.FP00003.2 x 2.5LVPECL1 - 220±20
±25
±50
-20 ~ +70
-40 ~ +85
2.5 - 3.3SiT9120
SiT9121
SiT9121AI-1C1-XXX000.FP00005.0 x 3.2
SiT9121AI-1D1-XXX000.FP00007.0 x 5.0
SiT9121AI-2B1-XXX000.FP00003.2 x 2.5LVDS1 - 220±20
±25
±50
-20 ~ +70
-40 ~ +85
2.5 - 3.3
SiT9121AI-2C1-XXX000.FP00005.0 x 3.2
SiT9121AI-2D1-XXX000.FP00007.0 x 5.0




可编程压控晶振空白片FP


FP空白片型号封装尺寸
(mmxmm)
信号模式频率范围
(MHz)
精度
(ppm)
温度范围
(℃)
工作电压
(V)
支持系列
SiT3808AI-22-XXXX-000.FP00003.2 x 2.5LVCMOS1 - 80±25
±50
-20 ~ +70
  -40 ~ +85
1.8
2.5 - 3.3
SiT3807
SiT3808
SiT3808AI-C2-XXXX-000.FP00005.0 x 3.2
SiT3808AI-D2-XXXX-000.FP00007.0 x 5.0